- AMD Ryzen™ Embedded 8000 Series Processors
- Up to 8 Zen 4 cores and RDNA™ 3 graphics with up to 6 WGPs (Work-group Processors)
- 2x DDR5-5600 non-ECC SO-DIMMs up to 96GB, 1x Gen4 x8, 1x Gen4 x2, and 6x Gen4 x1
- 4x USB 3.2 Gen 2, 2x SATA, 3x DDI, VGA, eDP/LVDS
- Supports optional Out-of-Band (OOB) management and onboard PCIe NVMe SSD
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The PCOM-B65C is a COM Express Compact module powered by the AMD Ryzen™ Embedded 8000 Series processors. It adheres to the COM Express COM.0 R3.1 specification and features AMD’s advanced “Zen 4” 4nm core architecture, RDNA™ 3 graphics, and XDNA™ NPU, delivering high-performance computing with a thermal design power (TDP) range of 28 to 45 watts, optimized for embedded use conditions. Additionally, the PCOM-B65C supports Out-of-Band (OOB) management, enabling remote power on/off, system reset, and BIOS updates.
The module supports PCIe Gen4 lanes and up to two DDR5 SO-DIMM slots with ECC or non-ECC memory, making it well-suited for mission-critical deployments and AI edge computing. It offers a rich I/O configuration, including up to 1x PCIe Gen4 x8, 1x Gen4 x2, and 6x Gen4 x1 lanes, along with four USB 3.2 Gen 2 ports, two SATA interfaces, and an optional onboard SSD of up to 1TB. With its compute performance and complete and flexible I/O capabilities, the PCOM-B65C is ideal for a wide range of embedded and industrial applications.
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