The tapered edges of the metal cap and the metal cap itself are a clear feature for Intel's Apollo-Lake processors – in everyday life it will disappear under the heat sink. offering a broader contact space for cooling solutions is one feature that will help embedded vendors to design more compact systems with even more processing power. This is the improved surface, but what improvements have been made inside the processor?
The newcomers are manufactured in 14nm technology and provide approximately 30 percent better computing and 45 percent more graphics / video performance than their predecessors. The power consumption remains relatively low with 6 to 12 W TDP and stays at the level of the former generation.
The new silicone features Intel's Gen 9 graphics, which in the past was reserved for the sixth-generation core processors only. This gives the new CPU series a significantly improved support for 4k graphics resolution. Up to three independent displays can be operated simultaneously, and DirectX 1.2, OpenCL 2.0 and OpenGL 4.2 are supported. The integrated security engine provides better security while the optional Error Correcting Code (ECC) preserves data integrity. The protection capabilities in the new processors were built from the ground up to ensure a new level of security. Each time the system starts up, secure boot with Intel Platform Trust Technology helps to keep the device safe, blocking dangerous programs, so only trusted software is launched. All this works behind the scenes of the new processor but delivers more power and advanced cooling to applications.
Comparison with former Atom generations
14 nm process
Up to 30% additional CPU performance
Gen6 GPU unit
Up to 30% additional GPU performance
Integrated security engine
Time Coordinated Computing
Improved Determinism form Fabric & Memory Quality of Serivice
Extreme coordination of sensing & actuation
Unified Timekeeping between CPU & PCle* Device via PTM Hardware
Full - HD Media Perfomance
Fast HD video acceleration over previous generation
Up to 15 simultaneous 1080p30 decode streams
Immersive 3D Graphics
Fast graphics and media performance @ISO power over previous generation
Enhanced API support
Integral Intel Security Engine
Fast cryptographic execution with Intel AES New Instructions
Secure/measured booting features
Improved I/O Capability
Fewer external hubs needed
MIPI* CSI v2.0 for Image Processor
Enhanced Integrated Sensor Hub(ISH4.0)
Reliable and Efficient Computing
Enhanced reliability with ECC
Optimized architecture for better QoS delivery
Full-featured T SKUs Q Tj=110*C extreme 7 year lifetime for Industrial
Ready-To-Go System Solutions
Portwell's wide-range product line gives customer rich choices. Customers can select different form factors from modules (COM Express, Q7, ETX) and embedded boards (ATX, Mini-ITX, Nano-ITX), SBC (PICMG 1.0, PICMG 1.3, Backplane), to systems (Panel PC, Box PC). With Portwell's unique modular design, no matter what kind of solution you're looking for, you can simply start by selecting your preferred platform. Then our complete one-stop service will help you on integration with software (BIOS, EC, embedded OS, BSP, API), hardware (expansion, form factor, peripheral devices, PSU), and system (thermal, chassis). It's simply like playing Lego; just picking up options of bricks then building them up into a system. This easy but quick way will only consume a short period of time on verification and validation. The next step is to meet customer's requirements with our flexibility and customization capability.
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