COM Express Type6 Compact size module with Intel® 13th Gen P/U Processor DDR5 SO-DIMM, DDI, PCIe Gen 4, USB4, USB 3.2 Gen2, 2.5 Gigabit TSN Ethernet, discrete TPM 2.0, eDP, SATA
  • 13th Gen Intel® Core™ Series processors in Intel 7 lithography
  • Up to 6x performance core + 8x efficient core, and up to 96x graphic execution units
  • 2x DDR5-5200 non-ECC SO-DIMMs up to 96GB, 2x Gen4 x4, and 8x PCIe Gen3 x1
  • 4x USB3.2 Gen2, 2x SATA, 3x DDI, VGA, eDP/LVDS
  • Options for Industrial Temperature Range -40°C up to +85°C
  • Options for onboard PCIe NVMe SSD
We also provide additional features to our finished products if requested.
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PCOM-B659 is COM Express module based on Intel® 13th Gen P/U platform. It is compatible with COM Express Rev3.1 standard. The platform adopt Intel 7 lithography and VNNI instruction set, offers advance computing power with 15~28W thermal and embedded use condition for wide range application. PCOM-B659 supports PCIe Gen4 lanes, and 2x Non-ECC DDR5 SO-DIMM, which is suit for mission critical use conditions and AI edge computing. This module also provides (up to) 8x PCIe Gen3 x1 lanes, 2x optional USB4(alternative with DDI), 4x USB 3.2 Gen 2, and 2x SATA . The complete and flexible I/O capacity also mapped to wide range of embedded/industrial applications.

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