Board Production Flow

Raw Material Inspection

Materials in the production line are prepared based on the packing list provided by the warehouse staff and are stored in the WIP buffer area.


 

Material Baking

Material Baking The SMD components tend to be thin, hence, can't endure high temperature.


 

Solder Paste Printing

Solder Paste PrintingA stencil plate is used to print the soldering paste thru the plate holes onto the PCB.


 

AOI - Soldering Paste

AOI - Soldering PasteOne-hundred percent automatic inspection of the PCB after solder paste printing detects defects and improves quality the first time.


 

Chips Mounting

Chips MountingHigh Speed Mounting pertains to different tiny components such as resistors, capacitors and ICs. This is a widely used procedure to achieve high precision production.


 

Visual Inspection

Visual InspectionVisual inspection stations are equipped with computers with Standard Operating Procedures (SOP) for each product. The SOPs are composed of diagrams which allow our technicians to run their inspection effortlessly and efficiently.


 

Reflow Soldering

Reflow SolderingReflow utilization uses an internal heat cycle system which allows the soldered components on the PCB to be soldered after cooling.


 

AOI - Mounting

AOI - MountingThe AOI machine uses an optical inspection method to verify that the printing, mounting, and reflow processes were completed without defects.


 

Visual Inspection & Repair

Visual Inspection & RepairOur visual technicians utilize magnifying glass examination to check for material flaws that causes undesirable tendency.


 

In-Circuit Testing (ICT)

In-Circuit Testing (ICT)The ICT automated test system can check the assembly circuit wafer, short circuits, abruptions, resistors, capacitors, inductor components values, as well as diode, transistor, FET, SCR, TRIAC, IC for anomallies. Upon completion, reports regarding production and statistics aid in identifying errors in the production process and ensure product quality.


 

IPQC

IPQCOur IPQC personnel examine all products according to the IPC-610D magnifying glass standards to determine and confirmed ECO, BOM and assure the production contents are without defects.


 

System Production Flow

Assembly

Makes certain that all the system components were assembled properly (Main board, Cable, Fan, HDD, etc.)


 

Visual Inspection

Once systems have been assembled, they will have already been visually inspected. Our inspectors ensure all components and accessories are assembled properly and follow MFG before testing.


 

IPQC

Verifies that all the production processes are completed correctly and accordingly to specification.


 

Basic Function Test

In order to ensure the system product is able to boot up by Dynamic Burn-In, 100% of the system products are tested for electronic functionality via a Basic Function Testing after assembly.


 

Dynamic Burn In Test

DBI is the test used before the product is shipped out. The purpose is to screen possible weaknesses and failures which affect its reliability under different environments.


 

Advanced Function Test

This procedure is to ensure the quality and functionality of the system product after the Burn-in test.


 

Packing

We inspect the product for external defectiveness. Once they have passed, we then collocate all accessories into plastic bags then proceed with boxing and labeling.


 

FQC

Finished and packed goods are placed in this area for inspection; the FQC department will inspect finished goods based on standard procedures.


 

OQC

To implement QC inspection procedure on packaged and finished goods, OQC has the MILā€“STD 105E Table. QC staff conducts sampling according to required sampling by quantity.


 

Shipping

In order to meet the demands of storage, transportation, loading and unloading the products mechanically, our pallet stretch wrap machine is designed to enhance production efficiency and prevent damage to the products during transportation.


 

ESD Protection

ESD is usually caused by HBM (Human-Body Model), MM (Machine Model), CDM (Charge d-Device Model) and FIM (Field-Induced Model). The advantages of preventing ESD in the factory include better product reliability, extended usage life, cost savings and increased yields.

In order to ensure that the products will not be affected by ESD during production, an ESD control procedure is in place to meet standards.

For operator

  • Wear anti-static suits and wrist straps in the factory.

For equipment

  • Each device and working area is grounded and tested periodically to confirm that the ESD measurement is normal.

For operator

  • Cover the anti-static tape on cables and test tools which are used in board functional testing.
  • Use acrylic shelves which may prevent electrostatic charge buildup.
  • Cover keyboards with an anti-static membrane to protect units under test from electrostatic damage.

For component

  • Suppliers of ESD sensitive components are required to handle and ship them in a protective manner.
  • Anti-static packaging is designed to prevent failures due to electrostatic charge build-up.