AMD Embedded Ryzen V-series based on Type VI Basic COM Express 2.0 module with dual channel DDR4 SO-DIMM slots, Dual DDI Interface, Dual Gigabit Ethernet, PCIe, SATA and USB 3.0/2.0
COM Express type 6, basic form factor
Up to 4 Ryzen V1000-series CPU cores
AMD® Radeon™ GFX9 with up to 11 compute units
Up to 16GB DDR4-2400 SO-DIMM
1x Gen3 PCIe x8, 1x Gen2 PCIe x4
Supports four 4K displays
2x SATA3 and 4x USB3.0
We also provide additional features to our finished products if requested. Contact us, for customized product package! Get A Quote
MEDM-B603 is designed with AMD next generation Ryzen V-Series SoC solution which leading 3D
graphics performance and high-performance Ryzen CPU core for the medical healthcare systems.
Specifications
Technology:
x86
Dimensions:
125 x 95 mm
Storage Temperature:
‐40 ~ 85℃
Operating Temperature:
0°C to +60°C
Firmware:
AMI UEFI BIOS
Audio:
High Definition Audio Interface
USB:
4x USB 3.0, 2x USB 2.0
Expansion:
One PCI Express x8 Interface from SoC chip, One PCI Express x4 Interface from SoC chip
Network:
Intel® i211AT
Storage:
2x SATA-III
Display Interface:
2x DDI Interface; VGA support
Graphic Controller:
AMD® Radeon™ Vega Graphics
DRAM:
Up to 16 GB , DDR4-2400 on 260-PIN Horizontal SO-DIMM socket
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