Materials in the production line are prepared based on the packing list provided by the warehouse staff and are stored in the WIP buffer area.
Material Baking The SMD components tend to be thin, hence, can't endure high temperature.
Solder Paste Printing
Solder Paste PrintingA stencil plate is used to print the soldering paste thru the plate holes onto the PCB.
AOI - Soldering Paste
AOI - Soldering PasteOne-hundred percent automatic inspection of the PCB after solder paste printing detects defects and improves quality the first time.
Chips MountingHigh Speed Mounting pertains to different tiny components such as resistors, capacitors and ICs. This is a widely used procedure to achieve high precision production.
Visual InspectionVisual inspection stations are equipped with computers with Standard Operating Procedures (SOP) for each product. The SOPs are composed of diagrams which allow our technicians to run their inspection effortlessly and efficiently.
Reflow SolderingReflow utilization uses an internal heat cycle system which allows the soldered components on the PCB to be soldered after cooling.
AOI - Mounting
AOI - MountingThe AOI machine uses an optical inspection method to verify that the printing, mounting, and reflow processes were completed without defects.
Visual Inspection & Repair
Visual Inspection & RepairOur visual technicians utilize magnifying glass examination to check for material flaws that causes undesirable tendency.
In-Circuit Testing (ICT)
In-Circuit Testing (ICT)The ICT automated test system can check the assembly circuit wafer, short circuits, abruptions, resistors, capacitors, inductor components values, as well as diode, transistor, FET, SCR, TRIAC, IC for anomallies. Upon completion, reports regarding production and statistics aid in identifying errors in the production process and ensure product quality.
IPQCOur IPQC personnel examine all products according to the IPC-610D magnifying glass standards to determine and confirmed ECO, BOM and assure the production contents are without defects.
System Production Flow
Makes certain that all the system components were assembled properly (Main board, Cable, Fan, HDD, etc.)
Once systems have been assembled, they will have already been visually inspected. Our inspectors ensure all components and accessories are assembled properly and follow MFG before testing.
Verifies that all the production processes are completed correctly and accordingly to specification.
Basic Function Test
In order to ensure the system product is able to boot up by Dynamic Burn-In, 100% of the system products are tested for electronic functionality via a Basic Function Testing after assembly.
Dynamic Burn In Test
DBI is the test used before the product is shipped out. The purpose is to screen possible weaknesses and failures which affect its reliability under different environments.
Advanced Function Test
This procedure is to ensure the quality and functionality of the system product after the Burn-in test.
We inspect the product for external defectiveness. Once they have passed, we then collocate all accessories into plastic bags then proceed with boxing and labeling.
Finished and packed goods are placed in this area for inspection; the FQC department will inspect finished goods based on standard procedures.
To implement QC inspection procedure on packaged and finished goods, OQC has the MIL–STD 105E Table. QC staff conducts sampling according to required sampling by quantity.
In order to meet the demands of storage, transportation, loading and unloading the products mechanically, our pallet stretch wrap machine is designed to enhance production efficiency and prevent damage to the products during transportation.
ESD is usually caused by HBM (Human-Body Model), MM (Machine Model), CDM (Charge d-Device Model) and FIM (Field-Induced Model). The advantages of preventing ESD in the factory include better product reliability, extended usage life, cost savings and increased yields.
In order to ensure that the products will not be affected by ESD during production, an ESD control procedure is in place to meet standards.
Wear anti-static suits and wrist straps in the factory.
Each device and working area is grounded and tested periodically to confirm that the ESD measurement is normal.
Cover the anti-static tape on cables and test tools which are used in board functional testing.
Use acrylic shelves which may prevent electrostatic charge buildup.
Cover keyboards with an anti-static membrane to protect units under test from electrostatic damage.
Suppliers of ESD sensitive components are required to handle and ship them in a protective manner.
Anti-static packaging is designed to prevent failures due to electrostatic charge build-up.